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    BGA voids inspecting machine smt X ray machine X5600 for SMT manufacturer (Offline X Ray series) widely used in offline detection, defect analysis, 3D reconstruction, used for PCBA, packaging, ceramics, plastics, LED, and so on Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1 Semiconductor packageWe,Shenzhen Zhuomao Technology Co,Ltd is a manufacturer with 15 years experience in the field of hot air BGA rework station/Mircofocus Xray inspection machine/LCD&LED panel repairing machine In the year of 2004, we had only 1 office in Shenzhen but now we have 4 branch offices in different cities such as Beijing, Suzhou, Chengdu and Wuhan city There will be more and more offices to makeSeamark 25D 3DCT XRay inspection equipment ZM2702 for

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    Überarbeitung und BGA Reballing Reconstruction of the balls of a BGA EES offers the service of BGA rework (µBGA, LGA) with the aid of the machine ERSA IR550A ERSA Rework IR 550A The main features of this machine are:Temperature3D reconstruction is essential for Surface Mount Technology (SMT) solder joint defect inspection Conventional visionbased reconstruction methods are very sensitive to the surface reflectivity3D reconstruction for SMT solder joint based on joint

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    In this video are three separate Xray inspections of BGA's, each revealing a distinctive solder joint defect called "headinpillow," so named for its resemblance to a head resting on a pillowThe defect is usually easy to spot using offaxis Xray 'Headinpillow' (HiP) defects occur under BGA devices when the solder sphere and the paste underneath it do not flow together, that is, theyÜberarbeitung und BGA Reballing Reconstruction of the balls of a BGA EES offers the service of BGA rework (µBGA, LGA) with the aid of the machine ERSA IR550A ERSA Rework IR 550A The main features of this machine are:TemperatureÜberarbeitung und BGA Reballing Electronic Engineering

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  • BGA Xray Inspection Service Process Sciences, Inc

    In this video are three separate Xray inspections of BGA's, each revealing a distinctive solder joint defect called "headinpillow," so named for its resemblance to a head resting on a pillowThe defect is usually easy to spot using offaxis Xray 'Headinpillow' (HiP) defects occur under BGA devices when the solder sphere and the paste underneath it do not flow together, that is, theyThe digital machine has to be running, and should the digital machine is in a cluster the cluster resource group ought to be online You are able to back up the virtual machine from the host, which comprises the digital hard disks and the configuration files or carry out a complete backup from inside the digital machineXview CT

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    Aug 30, 2018· BGA SMD LED Rework Station ZM R720 Automatic IC Removal Replace BGA QFP QFN CSP 0603 Components Duration: 5:56 PCB Rework & XRay Inspection, LCD Repair Machines